JTX ZX-01 Iphone 15 Series Silicone Middle Layer Bga Reballing Platform Set

JTX ZX-01 Iphone 15 Series Silicone Middle Layer Bga Reballing Platform Set   JTX ZX-01 Silicone Middle Layer Tin Planting BGA Reballing Platform Set for iPhone 15 Series   Key Uses of the JTX ZX-01 Silicone Middle Layer BGA Reballing Platform Reballing IC Chips: The platform securely holds BGA IC chips in place during the reballing process. Ensures proper alignment for solder ball replacement on IC chips. Repairing Logic Boards: Used when repairing or replacing damaged chips on the iPhone 15 series logic board. Helps to maintain the correct positioning of components during soldering. Heat Protection: The silicone material acts as a heat-resistant layer, protecting surrounding components from heat damage during reballing or soldering. Precise Work on Small Components: Provides a stable and accurate platform to handle the tiny IC chips found in modern iPhones, ensuring precision in repairs. BGA Stencil Compatibility: Compatible with BGA stencils, allowing technicians to apply solder balls to the chip with accuracy.   Package includes: 1 x Module Fixture 3 x Stencil